On March 13, Vice President YU Zhiwen led a delegation to the China Electronics Technology Group Chip Technology Research Institute (CETC Chip Technology) for research exchange, engaging in discussions with CAO Liquan, Deputy Party Secretary of CETC Chip Technology, DING Peng, Director of the Human Resources Department, and alumni representatives. ZHANG Yonggang, Dean of the College of Information and Communication Engineering, and FENG Guangsheng, Dean of the College of Computer Science and Technology, accompanied the visit.

YU Zhiwen stated that HEU (Harbin Engineering University) steadfastly upholds its “SMON” (shipbuilding industry, marine equipment, ocean exploration, and nuclear energy application) educational characteristics, actively aligning with major national strategic needs in the integrated circuit and information and communication fields, which closely correspond with CETC Chip Technology’s development direction. He noted that CETC Chip Technology, with its outstanding technical capabilities and critical industry position, serves as a vital partner for HEU in deepening industry-education integration and tackling key technologies. Moving forward, he expressed hope for enhanced collaboration between both parties to collectively serve national development needs.

CAO Liquan extended sincere gratitude for HEU’s longstanding support and briefly introduced CETC Chip Technology’s development progress and core technological achievements. He emphasized the enduring practical cooperation between both sides and expressed hope that this signing would serve as an opportunity to deepen communication and collaboration, focusing on joint talent cultivation, coordinated recruitment and development of high-end talent, and precise industry-academia-research cooperation. He called for continuously expanding the breadth and depth of collaboration to jointly contribute greater strength to the development of the national chip industry.

ZHANG Yonggang presented the college’s discipline development, talent cultivation, and research initiatives, expressing hope that this collaboration would deepen practical cooperation between both parties, facilitate effective implementation of university-enterprise synergy, and promote precise alignment between talent cultivation and industrial demands.

During the meeting, representatives from the university and CETC Chip Technology formally signed the High-Level Talent University-Enterprise Cooperation Agreement. Both parties aim to leverage this signing as a bond to jointly contribute to the high-level development of the national chip sector.

Following the meeting, YU Zhiwen and his delegation visited Chongqing Software Park, engaging with alumni enterprises and conducting discussions.